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E-Adhesives Series

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Description

       COOTECK Underfill Adhesives is a one-component heat curing epoxy resin, which designed to cure at low temperatures and to achieve good curing properties. It is used as bonding material for the package of BGA, CSP and Flip-chip. It can significantly improve the mechanical structure after curing by reducing the stress resulting from CTE mismatch between chip and substrates.

 

Features

  One component epoxy adhesive,
  Fast flowing
  Good capillarity to fill the fine pitch BGA or CSP
  Protect CSP, BGA, UBGA after assembly

 

Specification

Model

Color

Density

g/cm3

Viscosity mPa.s

Tg

Thermal expansion coefficient

Curing conditions

Storage temperature

Temperature

COO601

Cream

1.1

2500-3500

67

60-200

3min@150

2-8

Used for the package of BGA/CSP

COO601B

Cream

1.1

1500-2500

69

60-200

3min@150

2-8

COO602

Black

1.1

1500-2500

65

60-200

3min@150

2-8

COO602M

Black

1.1

1900-2100

69

55-185

3min@150

2-8

COO615

Black

1.1

1500-2500

95

66-170

7min@130

2-8

FC6100

Black

1.1

350-500

69

52-187

8min@130

-15--25

FC6130

Grey

1.1

4000-5000

148

40-140

10min@165

-40

Used for the package of FLIP-CHIP

FC6150

Black

1.6

9000-11000

120

30-100

30min@165

-40

Other specifications can be produced according to customer demand