Description
COOTECK Underfill Adhesives is a one-component heat curing epoxy resin, which designed to cure at low temperatures and to achieve good curing properties. It is used as bonding material for the package of BGA, CSP and Flip-chip. It can significantly improve the mechanical structure after curing by reducing the stress resulting from CTE mismatch between chip and substrates.
Features
◆ One component epoxy adhesive,
◆ Fast flowing
◆ Good capillarity to fill the fine pitch BGA or CSP
◆ Protect CSP, BGA, UBGA after assembly
Specification